MediaTek announced its latest 8000-series chipset with the Dimensity 8300. The new SoC is fabed on TSMC’s second-generation 4nm process and comes as a direct successor to last year’s Dimensity 8200 offering performance upgrades across the board.
MediaTek Dimensity 8300
Dimensity 8300 features 4x Arm Cortex-A715 performance cores clocked at up to 3.35GHz alongside 4x Arm Cortex-A510 efficiency units at up to 2.2GHz clock speeds. All eight cores are based on the Armv9 CPU architecture and MediaTek claims up to 20% faster CPU performance and 30% peak gains in power efficiency compared to the outgoing Dimensity 8200.
Dimensity 8300
Dimensity 8200
Dimensity 8100
Node
4 nm
4 nm
5 nm
CPU Prime
1x Cortex-A715 @ 3.35 GHz
1x Cortex-A78 @ 3.1 GHz
–
CPU Big
3x Cortex-A715 @ 3.0 GHz
4x Cortex-A78 @ 3.0 GHz
4x Cortex-A78 @ 2.85 GHz
CPU Little
4x Cortex-A510 @ 2.2 GHz
4x Cortex-A55 @ 2.0 GHz
4x Cortex-A55 @ 2.0 GHz
RAM
LPDDR5X (up to 8,533Mbps)
LPDDR5 (up to 6,400 Mbps)
LPDDR5 (up to 6,400 Mbps)
Storage
UFS 4.0 with MCQ
UFS 3.1
UFS 3.1
GPU
Mali-G615 (60% faster than 8200)
Mali-G610 MC6
Mali-G610 MC6
Display
FHD+ @ 180Hz, WQHD+ @ 120Hz
FHD+ @ 168 Hz, WQHD+ @ 120 Hz
FHD+ @ 180Hz, WQHD+ @ 120Hz
Camera (stills)
320 MP
320 MP
200 MP
Camera (video)
4K @ 60 fps (HDR10+)
4K @ 60 fps (HDR10+)
4K @ 60 fps (HDR10+)
5G
5.17 Gbps downlink
4.7 Gbps downlink
4.7 Gbps downlink
Wi-Fi
Wi-Fi 6E (2×2)
Wi-Fi 6E (2×2)
Wi-Fi 6E (2×2)
Bluetooth
5.4
5.3
5.3
The new chip also boasts an Arm Mali-G615 MC6 GPU which brings up to 60% performance gains and 55% improved power efficiency at peak speeds compared to its predecessor. MediaTek is also claiming up to 17% faster app cold launch and up to 47% faster app launch from standby with the new chip. The new chip also supports Quad-channel LPDDR5X RAM at 8,533Mbps speeds and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.
The APU 780 inside Dimensity 8300 makes it the first chip in its class to support Generative AI with stable diffusion and support for LLM with up to 10 billion parameters. The Imagiq 980 ISP supports up to 320MP camera sensors and 4K video recording at 60fps.
Dimensity 8300 breakdown
Dimensity 8300 features an integrated 5G modem with support for dual-mode 5G and up to 5.17Gbps downlink on sub-6GHz networks. The chip is alsow equipped with Wi-Fi 6E and Bluetooth 5.4 connectivity.
Xiaomi already confirmed that its Redmi Note 70E will debut the Dimensity 8300 later this month.
Source
{Categories} _Category: Platforms,*ALL*{/Categories}
{URL}https://www.gsmarena.com/mediatek_dimensity_8300_brings_armv9_cpu_60_faster_gpu_and_generative_ai_capabilities_-news-60651.php{/URL}
{Author}unknown{/Author}
{Image}https://fdn.gsmarena.com/imgroot/news/23/11/mediatek-dimensity-8300-ofic/-728×314/gsmarena_00.jpg{/Image}
{Keywords}news{/Keywords}
{Source}Platforms{/Source}
{Thumb}{/Thumb}